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A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22).

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A test set socket adaptor (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adaptor (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22).

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The test socket 10 is designed to be plugged into a circuit board (not shown) with a plurality of other test sockets and chips. The board may then be used to run chips such as chip 12 through an alternating current (AC) test, as well as a burn-in test. The AC test checks the AC performance of the chip, and the burn-in test overstresses the chip in both voltage and temperature to eliminate ...

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Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD).In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows ...

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